TMS320DM335 processor features advanced image capture and HD display capabilities to provide rich content for new class of portable electronics
Texas Instruments Incorporated (TI) (NYSE:TXN) today announced its lowest-cost digital media processor, the TMS320DM335 device, for applications driven by advanced image capture and display requirements. Consumers will now be able to have enhanced interaction with their [...]
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Design costs for portable display electronics drop with TI’s lowest cost digital media processor
Lam Research Corporation Releases 2300 Versys Kiyo3x Conductor Etch Series
Lam Research Corporation (NASDAQ:LRCX), a major supplier of semiconductor wafer fabrication equipment and services, today introduced the 2300 Versys Kiyo3x conductor etch series. Innovative Kiyo3x technologies deliver CD uniformity of 1 nm across the wafer, which provides enabling capability for managing the challenging CD and overlay budgets of emerging double patterning applications. Kiyo3x field-upgradeable options [...]
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GSS8000 High Dynamics GPS Simulation System
Spirent Communications plc (LSE: SPT) the leading provider of navigation and positioning test solutions, today announces improved high dynamic capabilities on its new Spirent GSS8000 simulation system.
The Spirent GSS8000 is designed for use in the most demanding applications, and is capable of simulating ultra-high dynamics with industry leading accuracy.
Continue reading " GSS8000 High Dynamics GPS Simulation System "
Tags: antenna, Canada, CRPA, DOF, GPS, GSS, John Pottle, navigation, PPS, Spirent, SPT, Technology, testing, U.S.
Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and [...]
Bluetooth SIG Opens New Doors to Small Businesses
The Bluetooth SIG announced today that it is launching the Bluetooth Small Business Incentive Program designed to grow the Bluetooth technology market by creating new avenues of innovation and market entry for small businesses. The incentive program will provide a one- time discount on qualification related fees to those who apply for and meet the [...]
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CPU Tech Launches Acalis CPU872 MultiCore PowerPC with Embedded DRAM and Tamper Protection
CPU Technology, Inc. (CPU Tech) announced today the immediate availability of the Acalis CPU872 System-on-a-Chip (SoC) with embedded DRAM and tamper protection for qualified customers.
The Acalis CPU872, a Field Programmable MultiCore (FPMC), directly addresses the need for a tamper-resistant, trusted supply of high-performance processing devices for use in vital applications. Fabricated at the IBM [...]
Tags: Charles Caposell, Chip, CPU, DoD, DRAM, Ed King, FPMC, MultiCore, PowerPC, Technology, Trojan, U.S.
Lexar Media Announces the Crucial Reliance Program for Server and Workstation Memory
Lexar Media today announced the Crucial Reliance Program for server and workstation memory needs. The new Crucial Reliance Program is the first of several forthcoming server-related memory announcements, and signifies a renewed focus in the server memory arena. Qualified Crucial business and government customers can receive enhanced sales and support benefits. Examples of participant benefits [...]
New Lenovo Management Console
Lenovo and LANDesk today announced Lenovo will offer LANDesk technology as the core of the new Lenovo ThinkManagement Console. The new console provides centralized inventory and reporting of Lenovo client hardware assets and Lenovo’s industry-leading ThinkVantage Technologies, as well as management of Intel vPro enabled devices. Integration tools are also provided to facilitate third party [...]
Next Generation of Java Card Technology
Sun Microsystems, Inc. (NASDAQ:JAVA) and the Java Card Forum (JCF) today announced the availability of version 3.0 of the award winning Java Card platform specification, to help kickoff the SIMPosium 2008 Conference in Berlin. This release is the most significant architectural expansion in the dynamic, 10 year history of Java Card technology and a revolutionary [...]
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- Intel Fourth-Quarter Net Income $2.3 Billion, Up 875%
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- Philips updates markets on Healthcare sector in meeting with financial analysts
- HK McDonald’s head convicted in bribery case
- Autodesk Settles German Copyright Infringement Case
- AMD Extends the Mainstream Value of Dragon Platform Technology with 45nm AMD Phenom II Triple-Core Processors
- Elbit Systems’ Subsidiary, Elisra, Awarded a Contract Valued at $60 Million
- AT&T to Acquire Centennial Communications
- Dailymotion Brings Video to One Laptop per Child Foundation’s XO Laptop
- Verizon and Yahoo! Extend Strategic Alliance with New Multiyear Co-branded Portal Agreement
- Watch Ad-Free Movies and TV Shows on Macs, PCs and Compatible Sony BRAVIA Televisions
- Broadcom Announces New Digital Television Solution Supporting Global Connectivity
- SAP Launches Co-Innovation Lab in Tokyo
- Design costs for portable display electronics drop with TI’s lowest cost digital media processor
