Suffern, N.Y. (PRWEB) January 30, 2008

General Patent Corporation International (GPCI), a leading patent licensing and enforcement firm, announced today on behalf of its client, Digital Technology Licensing LLC (DTL), that it has licensed a key cell phone patent to Samsung Electronics Co., LTD.

DTL owns U.S. Patent No. 5,051,799 titled “Digital Output Transducer” (Patent), which is an essential patent for Adaptive Multi-Rate (AMR) codec and other cellular communication standards. The patented technology is also used to assure backward compatibility of cell phone handsets and base stations.

“We are very pleased to extend a non-exclusive license to Samsung,” said Alexander Poltorak, GPCI’s Chairman and CEO.

GPCI represents DTL in the licensing and enforcement of the Patent. DTL brought patent infringement suits against Verizon Wireless, Cingular Wireless, T-Mobile, Sprint and other companies. Samsung was not a party to any of these lawsuits. Previously, DTL announced that Nokia and Ericsson licensed its Patent.

Digital Technologies Licensing LLC

Digital Technology Licensing LLC (DTL), of Suffern, N.Y., is the owner of U.S. Patent No. 5,051,799 titled “Digital Output Transducer.” DTL is a portfolio company of an idea incubator affiliated with IP Holdings LLC, and is managed by GPCI. A non-exclusive license under the patent is available on reasonable and non-discriminatory terms. For licensing terms, please contact Paul Lerner at (845) 368-4000 x104. For more information, please visit www.digitaltechnologylicensing.com.

About General Patent Corporation International

General Patent Corporation International (GPCI) is a premier intellectual property (IP) licensing and enforcement firm headquartered in Suffern, N.Y. GPCI is the managing member and the exclusive licensing agent of DTL. GPCI represents clients in IP assertive licensing and enforcement matters on a contingency basis and assists IP owners in enforcing their rights through patent, trademark and copyright infringement litigation. GPCI is the oldest contingency IP enforcement organization in the United States. General Patent Corporation (GPC) is an affiliate of GPCI providing IP management consulting with a focus on IP strategy and valuation (see www.generalpatent.com). For more information on GPCI, please visit www.patentclaim.com.

About IP Holdings LLC

IP Holdings LLC, another affiliate of GPCI, is an IP-centric merchant banking organization. IP Holdings provides IP-related financial services as well as IP brokerage services. IP Holdings also operates an idea incubator. For more information on IP Holdings visit www.ip-holdings.com.

For further information on DTL, GPCI, GPC and IP Holdings contact General Patent Corporation International, Montebello Park, Suffern, NY 10901-3740; telephone: (845) 368-4000; e-mail: info @ gpci.com.

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The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.

“There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth.” said Bob Bruck, vice president and general manager, Technology Manufacturing Engineering in Intel’s Technology and Manufacturing Group. “We, along with Samsung and TSMC, agree that the transition to 450mm wafers will follow the same pattern of delivering increased value to our customers.”

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.

“The transition to 450mm wafers will benefit the entire ecosystem of the IC industry, and Intel, Samsung, TSMC will work together with suppliers and other semiconductor manufacturers to actively develop 450mm capability,” said Cheong-Woo Byun, senior vice president, Memory Manufacturing Operation Center, Samsung Electronics.

In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities (also known as “fabs”) were introduced in 1991.

Keeping in line with the historical pace of growth, Intel, Samsung and TSMC agree that 2012 is an appropriate target to begin the 450mm transition. Given the complexity of integrating all of the components for a transition of this size, the companies recognize that consistent evaluation of the target timeline will be critical to ensure industry-wide readiness.

“Increasing cost due to the complexity of advanced technology is a concern for the future,” said Mark Liu, TSMC’s senior vice president of Advanced Technology Business. “Intel, Samsung, and TSMC believe the transition to 450mm wafers is a potential solution to maintain a reasonable cost structure for the industry.”

The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.