VANCOUVER, CANADA (PRWEB) April 22, 2004

Belcarra Technologies, a leading developer of USB software and network solutions, today announced the release of the Intel® PXA 27x driver rounding out BelcarraÂ’s wide-ranging support of USB drivers for Linux® devices.

TodayÂ’s mobile devices support a wide variety of communications media, but only USB is universally available on existing desktop PCÂ’s. In addition, USBÂ’s high data transfer speed, sophisticated, power conservation, reliability and security make it the medium of choice for communicating with desktop PCÂ’s.

The Intel PXA 27x integrates a rich and powerful USB subsystem, which Belcarra’s Linux USB Framework allows an OEM to use to full advantage with minimum integration time. By adding a ‘Bulverde’ chip driver Belcarra reinforces its position as a leading of USB provider for embedded systems. Belcarra’s recently released Version 2 of its USB Device stack offers its customers support for 10 different hardware platforms.

Belcarra Technologies USB software, professional services and systems integration expertise keeps development costs down for OEM’s by reducing risks and time-to-market. Bruce Balden, President of Belcarra notes “Belcarra’s USB solutions are distinguished from others by being end-to-end, battle hardened, and by including integration support”.

About Belcarra – Belcarra Technologies Corp. provides comprehensive USB support that includes a suite of tools for networking desktop computers (MS Windows®, Mac OS/X™, and Linux) with embedded devices over USB. Belcarra offers proprietary solutions as well as those within the GPL Linux USB Device Framework, which its engineers created and continue to support. For more information, please contact a Belcarra representative at +1.604.728.6054, info@belcarra.com or visit the Belcarra website www.belcarra.com.

Linux is a registered trademark owned by Linus Torvalds

Mac OS/x is a trademark of Apple Computer, Inc.

Microsoft, Windows, are registered trademarks of Microsoft Corporation;

Intel, XScale, MMX technology are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries

Related Oem Press Releases

Chicago, Illinois (PRWEB) May 9, 2009

R1 Intel, a worldwide provider of global innovation and competitive intelligence, has introduced five new products to deliver patent innovation intelligence to subscribers. Critical business and competitive intelligence are delivered to your desktop in the following ways:

Technology Innovation Monitors: Provide information on innovation developments related to specific industry market sectors. The information is pulled from the Global Innovation Dataset™, which is comprised of worldwide patents and patent applications. These portals list patented and pending patented technologies, assignees, researchers and inventors, and related analytics associated with the specific industry sector. Graphs, PDF’s, charts, maps, and tables present innovation data in an easy-to-use format.

Entrepreneur Patent Roadmap: Separating innovation from litigation, entrepreneurs now can vet their patents and see how their ideas stack up against the Global Innovation Dataset. R1 Intel will provide you with a competitive analysis and overlap analysis of your patent(s) and identify all of the players in your market space to assist in identifying potential licensees.

Executive Innovation Dashboard: Keeping with the theme of separating innovation from litigation, R1 Intel provides an executive dashboard detailing how a company’s most important assets, innovation and intellectual property, are performing in the global market place. Monitor global competitors, market trends, university research and all innovation related to your intellectual property in one easy to use portal.

Inventor Watch: Research and monitor human capital with R1 Intel’s Inventor Watch. Inventor Watch is a global human resource tool for researching new hires and current and past employee intellectual property activity. R1 Intel can provide one-time reporting on new hires as well as set up Inventor Watch monitors for all employees.

Technology Innovation Blogs (TOGS): Industry experts and stakeholders within technology sectors can access up to date information on global innovation and based on this information, deliver perspective and insight on how these new innovations are shaping the marketplace. Visit www.r1intel.com/TOGS.html

About R1 Intel™

R1 Intel is a provider of global intelligence and educational platforms providing inventors, companies, universities and law firms access to the world’s most inclusive patent database to search and analyze the Global Innovation Dataset of over 85 million documents covering 124 countries. R1 Intel’s products help to identify prior and subsequent cited and uncited innovation as well as concurrent innovation with unparalleled analytics packages. R1 Intel’s comprehensive patent timelines, legal activity monitors and overlap analytics mine competitive intelligence and emerging innovation as it unfolds. R1 Intel helps inventors, companies, universities and law firms see markets and competitors from different perspectives and enhance business development intellectual property efforts. Visit www.r1intel.com.

Contact:

Doug Keating

R1 Intel

688 N. Milwaukee

Suite 303

Chicago, IL 60642

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“Intel’s strong 2009 results reflect our investment in industry-leading manufacturing and product innovation,” said Paul Otellini, Intel president and CEO. “This strategy has enabled us to generate unprecedented operating efficiencies while growing our traditional businesses and creating exciting new market opportunities, even in difficult economic times. Our ability to weather this business cycle demonstrates that microprocessors are indispensable in our modern world. Looking forward, we plan to deliver the benefits of computing to an expanding set of products, markets and customers.”

Intel’s new hafnium-based 45nm Hi-k silicon process technology enables even more processor performance by doubling transistor density and increasing cache size by up to 50 percent. The Intel Core2 Duo processor T9400, validated with the Mobile Intel GM45 Express chipset, provides excellent processor and graphics performance, storage speed, system memory and reliability, making it ideal for a broad range of embedded applications.

Over the past year, Intel has utilized Phoenix’s BIOS software on its reference boards. Phoenix’s firmware solutions provide complete support for current industry standards and initiatives.

Phoenix SecureCore and AwardCore for embedded applications are available now for the Intel Core2 Duo Processor T9400 with both the Mobile Intel GM45 Express chipset and the Intel 5100 Memory Controller Hub (MCH) chipset.

The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.

“There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth.” said Bob Bruck, vice president and general manager, Technology Manufacturing Engineering in Intel’s Technology and Manufacturing Group. “We, along with Samsung and TSMC, agree that the transition to 450mm wafers will follow the same pattern of delivering increased value to our customers.”

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.

“The transition to 450mm wafers will benefit the entire ecosystem of the IC industry, and Intel, Samsung, TSMC will work together with suppliers and other semiconductor manufacturers to actively develop 450mm capability,” said Cheong-Woo Byun, senior vice president, Memory Manufacturing Operation Center, Samsung Electronics.

In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities (also known as “fabs”) were introduced in 1991.

Keeping in line with the historical pace of growth, Intel, Samsung and TSMC agree that 2012 is an appropriate target to begin the 450mm transition. Given the complexity of integrating all of the components for a transition of this size, the companies recognize that consistent evaluation of the target timeline will be critical to ensure industry-wide readiness.

“Increasing cost due to the complexity of advanced technology is a concern for the future,” said Mark Liu, TSMC’s senior vice president of Advanced Technology Business. “Intel, Samsung, and TSMC believe the transition to 450mm wafers is a potential solution to maintain a reasonable cost structure for the industry.”

The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.

Until now, the sharing of patient information among healthcare network participants has been hindered by the steep costs and complexities of proprietary data and integration services. Based on Service Oriented Architecture (SOA), Intel SOA Expressway for Healthcare offers a cost-efficient solution to this problem by providing an efficient and scaleable way to translate, process and connect any data format across a healthcare network.

In addition, Intel has created a group of validated independent software vendors (ISVs) that provides best-of-breed capabilities to deploy a complete health network powered by the Intel SOA Expressway. Current validated ecosystem vendors include Apelon, Infotech Global (IGI), Initiate Systems, Oracle and Red Hat. Services provided by these vendors include controlled medical vocabulary translation, clinical patient portal applications, enterprise master patient index, clinical data repository and operating system support. The validated ecosystem helps complete next-generation SOA architecture for healthcare data interoperability.

The software solution has been successfully piloted with several healthcare providers, including at a hospital network in Shanghai. “Intel SOA Expressway for Healthcare solved a very difficult hospital integration scenario for us,” said Shen Ping, general manager of Health Services Division at Wonders Information Co, the systems integrator deploying the Shanghai health network. “We were surprised to see that it was able to meet our performance requirements for daily synchronization of nearly a million hospital records in a short amount of time.”

Intel SOA Expressway for Healthcare provides the performance of a hardware appliance in a software form factor that offers native message acceleration for rapid data exchange, workflow management and translation to enable data exchange to and from any original format. This advance in software is an example of how technology can help improve patient care and reduce healthcare costs by streamlining information flow.

“Intel has developed the SOA Expressway for Healthcare as a platform that can be used with a wide variety of existing IT environments to provide world-class integration regardless of the specific electronic medical records and other software platforms used at individual healthcare facilities,” said Renee James, vice president and general manager of Intel’s Software and Solutions Group. “We also leveraged the SOA architecture to drive down costs, which has enabled Intel to offer our solution at prices comparable or below other solutions in the market.”

In order to make Intel SOA Expressway for Healthcare as versatile as possible, Intel designed it as a flexible product offering that can stand alone as the gateway to and from a community health information network or can be bundled as part of an ISV solution.