OKI Printing Solutions (the brand name for OKI Data Corporation) and Swedish technology company, Anoto, today jointly announced that the innovative C8800 Series, A3 color LED printers are the latest to join its range of Anoto Qualified Printers to accurately and consistently print forms based on Anoto technology, ensuring the best possible Digital Pen performance.

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Spirent Communications plc (LSE: SPT) the leading provider of navigation and positioning test solutions, today announces improved high dynamic capabilities on its new Spirent GSS8000 simulation system.

The Spirent GSS8000 is designed for use in the most demanding applications, and is capable of simulating ultra-high dynamics with industry leading accuracy.

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Adobe Systems Incorporated (Nasdaq:ADBE) today announced a new version of Adobe Acrobat Connect Pro, the company’s comprehensive Web conferencing and eLearning solution. The version includes new functionality that enriches online communication and collaboration, enabling organizations and schools to offer more engaging rapid training, interactive virtual classes and dynamic online meetings.

Acrobat Connect Pro includes many new features for Web conferencing such as options for archiving and editing recorded online meetings; new presence capabilities that can allow federation with popular instant messaging (IM) clients; and powerful compliance and usage reporting tools. eLearning enhancements include break-out rooms to let students in virtual classes initiate separate conversations online; rapid authoring of video-based content; integration with Learning Management Systems (LMS) from Blackboard and SumTotal; and tools that track and organize online classes. Users also can easily tailor training sessions or meetings that help capture participants’ attention and increase knowledge retention, resulting in an online learning experience remarkably similar to an in-person class.

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Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.

The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.

“There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth.” said Bob Bruck, vice president and general manager, Technology Manufacturing Engineering in Intel’s Technology and Manufacturing Group. “We, along with Samsung and TSMC, agree that the transition to 450mm wafers will follow the same pattern of delivering increased value to our customers.”

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.

“The transition to 450mm wafers will benefit the entire ecosystem of the IC industry, and Intel, Samsung, TSMC will work together with suppliers and other semiconductor manufacturers to actively develop 450mm capability,” said Cheong-Woo Byun, senior vice president, Memory Manufacturing Operation Center, Samsung Electronics.

In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities (also known as “fabs”) were introduced in 1991.

Keeping in line with the historical pace of growth, Intel, Samsung and TSMC agree that 2012 is an appropriate target to begin the 450mm transition. Given the complexity of integrating all of the components for a transition of this size, the companies recognize that consistent evaluation of the target timeline will be critical to ensure industry-wide readiness.

“Increasing cost due to the complexity of advanced technology is a concern for the future,” said Mark Liu, TSMC’s senior vice president of Advanced Technology Business. “Intel, Samsung, and TSMC believe the transition to 450mm wafers is a potential solution to maintain a reasonable cost structure for the industry.”

The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.

The Bluetooth SIG announced today that it is launching the Bluetooth Small Business Incentive Program designed to grow the Bluetooth technology market by creating new avenues of innovation and market entry for small businesses. The incentive program will provide a one- time discount on qualification related fees to those who apply for and meet the SIG’s small business designation criteria.

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Today at Interop, the industry’s leading business technology event, Storage Appliance Corporation introduced the Clickfree Office DVD Backup solution for small, medium and large sized businesses.

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eTelemetry, the leader in extracting real-time business information from network activity, today announced launch of Metron 2.0. This new release adds bandwidth rate limiting, and website blocking and filtering capabilities to Metron, a plug-and-play network appliance that monitors individual and department-level bandwidth usage and network activity.

Metron 2.0 ensures that online enterprise applications get bandwidth before non-work related sites. It offers multiple strategies to control access speeds to websites, including throttling down bandwidth available for websites that are not mission critical. Metron 2.0 also rate limits, filters, and blocks access to websites by person or department.

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CPU Technology, Inc. (CPU Tech) announced today the immediate availability of the Acalis CPU872 System-on-a-Chip (SoC) with embedded DRAM and tamper protection for qualified customers.

The Acalis CPU872, a Field Programmable MultiCore (FPMC), directly addresses the need for a tamper-resistant, trusted supply of high-performance processing devices for use in vital applications. Fabricated at the IBM Trusted Foundry in cooperation with the Trusted Access Program Office and U.S. Navy sponsorship, the Acalis CPU872 combines defenses against malicious circuits and other Trojan horses, and effective and resilient run-time techniques to protect against tampering and reverse-engineering without impacting performance.

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Cognos, an IBM company and world leader in business intelligence and performance management solutions, today announced the launch of a new performance application designed to help commercial bankers efficiently price new deals, taking into consideration associated risk factors and the profitability of the overall customer relationship.

The IBM Cognos Relationship Pricing for Commercial Banking Blueprint offers commercial banks a performance management framework that enables relationship managers to efficiently model and price both credit and non-credit deal scenarios that are in line with corporate objectives. Managers can analyze proposed deals against a customer’s existing portfolio, giving them complete visibility into the customer’s total projected profitability and corresponding risk, making it easier to identify a deal price that will meet or exceed a bank’s defined earnings hurdle rates, and improve risk-adjusted return on capital.

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The Data Security Company, today announced the release of SafeGuard Enterprise 5.3. A major highlight of this release is the addition of the new SafeGuard Configuration Protection Module for port and configuration protection which is now integrated within SafeGuard Enterprise and delivers on Utimaco’s strategy to offer an integrated encryption and data leakage prevention (DLP) solution.

Industry statistics consistently show that the most significant threat to organizations comes from within. With over 70 percent of corporate data residing on endpoints, pure gateway security solutions and written security policies alone cannot mitigate the risks of information leakage. Increased awareness of these internal security breaches, along with regulatory pressure, and the potential for brand damage and bad press, has fueled the rapidly growing DLP market.

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