“Intel’s strong 2009 results reflect our investment in industry-leading manufacturing and product innovation,” said Paul Otellini, Intel president and CEO. “This strategy has enabled us to generate unprecedented operating efficiencies while growing our traditional businesses and creating exciting new market opportunities, even in difficult economic times. Our ability to weather this business cycle demonstrates that microprocessors are indispensable in our modern world. Looking forward, we plan to deliver the benefits of computing to an expanding set of products, markets and customers.”

See also:

• Phoenix Firmware Supports New 45nm Intel Core2 Duo Processor T9400 (0)
• Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (0)
• New Intel Software Connects Health Networks, Enabling Key Data Sharing in Clinical Settings (0)

According to DisplaySearch’s latest Quarterly LED & CCFL Backlight Report, InnoLux was the leading supplier of LED backlit monitor panels in Q3’09, with 34.4% of unit shipments (Table 1). Other panel makers producing such panels include LG Display, AUO, Samsung and CMO. Brands like Samsung, Dell, LG, Acer, Lenovo, BenQ and AOC began launching LED backlit LCD monitors ranging from 18.5”W to 24”W in Q3’09. In Q1’10, 20”W, 23.6”W and 27”W panels will enter the market. In addition, there are small LCD TV sizes such as 26”W that are adapting monitor panels, the LED backlight is also brining the attractions to this segment. TV brands like Vizio are promoting 18.5”W and 23”W LCD TV using LED backlit monitor panels, and more brands are expected to join in 2010.

Table 1: LED Backlight LCD Monitor Panel Shipment Share in Q3’09

Source: DisplaySearch Quarterly LED & CCFL Backlight Report

“LEDs have significant advantages over traditional backlights, such as power consumption, slim form factor, and product differentiation,” noted Brian Chen, DisplaySearch Research Director for TFT LCD & Materials and the author of the report. “While there are still some technical concerns such as brightness performance, the LED backlight premium in the LCD monitor is much smaller than LCD TV. Meanwhile, the awareness of green technology and energy savings factors in LEDs has generated consumer demand. We are seeing panel makers and also monitor brands promoting LED backlights—resulting in panel makers’ aggressive target for 22% penetration in Q3’10.”

The DisplaySearch Quarterly LED & CCFL Backlight Report tracks TFT LCD manufacturers’ shipments of LED backlights panels and includes forecasts by size, by resolution, by LED type, and by panel manufacturers and rolling in a eight quarters forecast. This unique report is the most comprehensive way to find out how LED backlight will contribute to growth across the industry, making it a key guide for panel buyers, notebook, LCD Monitor and LCD TV product planners and component makers. For information on the DisplaySearch Quarterly LED & CCFL Backlight Report, contact Charles Camaroto at 1.888.436.7673 or 1.516.625.2452 or email contact@displaysearch.com, or contact your regional DisplaySearch office in China, Japan, Korea or Taiwan.

“We’re continuing to create new, convenient ways for our customers to watch digital movies and TV shows. The ability to watch content instantly without downloading first was among the most requested features of our customers, and now it’s live—customers can instantly watch the ad-free title of their choice on a Mac, PC or compatible Sony BRAVIA TV via Sony’s BRAVIA Internet Video Link device,” said Roy Price, director of Amazon Video On Demand. “Amazon Video On Demand provides customers with the choice of how to watch their favorite movies and TV shows, be it on their PC or Mac, on the TV with TiVo or through Sony’s BRAVIA Internet Video Link device on compatible Sony BRAVIA TVs, or on the go with a portable video player.”

Also starting today, Sony BRAVIA Internet Video Link users can rent or purchase and instantly watch movies and commercial-free TV shows directly on their compatible BRAVIA TV. With the Sony BRAVIA Internet Video Link, customers can explore and purchase or rent from the Amazon Video On Demand library with the push of a button. To get started, customers simply go to www.amazon.com/videoondemand/bravia and link their BRAVIA to their Amazon.com account. After a purchase is made, the title can be immediately watched. A backup version can also be found in Your Video Library, accessible from the Sony BRAVIA Internet Video Link device user interface or on Amazon.com. Customers interested in purchasing a Sony BRAVIA television and/or Sony BRAVIA Internet Video Link device can do so in the Amazon.com Electronics store at www.amazon.com/electronics. Amazon Video On Demand through the BRAVIA Internet Video Link is currently in beta.

Amazon Video On Demand, operated by Amazon Digital Services, Inc., is the only U.S. digital video service that gives customers the choice to stream or download premium movies and TV shows. With over 40,000 licensed movies and TV shows, customers can now watch on their Mac, PC, Sony BRAVIA TV, TiVo box, Windows Media Center extender devices such as Xbox 360, and portable media players. The Amazon Unbox Video Player will remain as the client application for downloaded content, allowing customers to watch purchased content on their computer when they are not connected to the Internet or transfer it to a portable media player. With Fall TV starting in early September, Amazon Video On Demand will have a full selection of the most popular returning and new shows, including pilots, premieres, and full episodes.

To enable TV manufacturers to take advantage of this growing digital TV market, Broadcom announces its BCM3556 single-chip DTV solution at the IFA Show in Berlin that now supports multiple compatibility standards in Europe and Asia. The Broadcom(R) BCM3556 DTV SoC also includes an advanced feature set including multi-format picture decoding in support of high definition AVC, H.264, VC-1, AVS and MPEG-2 streams. By supporting H.264, the latest video compression standard, the BCM3556 enables users to view multimedia and HD content with improved picture quality at lower bandwidth when accessing content from other consumer devices in the home network. The BCM3556’s support of H.264 also provides access to H.264 broadcast content without the need of an additional decoder within the digital television.

The BCM3556 also integrates a host of features that allow TV manufacturers to create differentiated products, and when combined with improved picture quality, will enrich the consumers’ DTV experience. One such feature is a 3D graphics core that provides consumers with a graphical user interface for flipping, rotating, moving or manipulating images, and enables OEMs to create specialized user interfaces that differentiates the TV from traditional flat, two dimension user interfaces.

“With the BCM3556, our DTV design partners can expand the use of Broadcom SoCs to address European and Asian markets,” said Dan Marotta, Senior Vice President & General Manager of Broadcom’s Broadband Communications Group. “By providing additional worldwide standards in our DTV product line, along with differentiated features to TV manufacturers, our design partners, in turn, can offer viewers greater connectivity and enhanced interactivity.”

The advanced home network connectivity of the BCM3556 includes an integrated Ethernet media access controller (MAC) and physical layer (PHY) device that enables the SoC to connect with multiple home networking devices such as media servers, PCs, MP3 and portable media players. As a result, users can share and stream music, photo and movie content to and from connected TVs. A high-powered CPU, featuring a MIPS(R) dual core processor, rounds out the BCM3556’s capabilities by providing consumers with a fast and responsive seamless user interface to content from either traditional broadcast sources as well as from personal or internet content.

The BCM3556 is available in package configurations that support WXGA (wide screen) display resolutions and a full 1080p high definition resolution. The new DTV SoC also incorporates a unique 3D color management system, as well as digital, analog and mosquito noise reduction. Also integrated is an advanced picture enhancement processor (PEP) to improve picture sharpness and perform picture post-processing functions. The PEP engine is fully programmable and can be optimized by each TV manufacturer to meet their respective quality requirements. As a result, the BCM3556 SoC enables TV manufacturers with better video quality, sharper images and more accurate color reproduction.

Technical Information

The BCM3556 is Broadcom’s next generation DTV SoC that features an advanced video decoder, 3D graphics core, Ethernet MAC and PHY, and support for either WXGA or 1080p HD resolutions. These features, combined with a high level of integration and picture quality, will greatly enhance the DTV experience and enable TV manufacturers to reduce overall system cost and improve picture quality, all with a single SoC. Additional features are as follows:

— Advanced multi-format decoder supports the following:
– H.264/AVC Main and High Profile to Level 4.1 (HD), Level 3.1 (SD) -
HD/SD AVS Jizhun Profile Levels 2.0, 4.0, and 6.0
– VC-1 Advanced Profile @ Level 3, Simple and Main Profiles
– HD/SD MPEG-2 Main Profile at Main and High levels
– MPEG still image decode
– HD DivX(R) 3.11/4.11/5.x/6x/Home Theater
— 3D/2D OpenGL(R) ES 1.0-compliant graphics core
— Ethernet MAC and PHY
— Integrated video processing:
– 3D color management
– Digital, analog and mosquito noise reduction
– 1080i motion adaptive de-interlacing with 3:2/2:2 pull-down
– True 10-bit video
— Extensive audio support:
– AAC LC, AAC LC+SBR Level 2, AAC+ Level 2, AAC-HE
– Dolby Digital(R), Dolby Digital Plus, TruSurround XT(R)
– MPEG 1 Layers 1, 2, and 3 (MP3)
– Windows Media(R) and Windows Media Pro audio
– Audio DACs, input switch and equalizer
– Dolby Digital, TruSurround XT, MPEG Audio Decoder
— Integrated DVB-T COFDM terrestrial demodulator:
– Standards compliance: ETSI EN 300 744, Nordig Unified v1.0.3, DTG
D-Book 5 compliant
– Excellent Doppler performance
– Active impulse noise suppression
— PAL/SECAM demodulator
— PAL decoder with a 3D/2D comb
— 400-MHz Dual Core CMT MIPS32(R)/MIPS16e(TM) class processor
— NICAM audio decoder
— Single/dual-link LVDS transmitters
— Dual HDMI 1.3a receivers
— Dual USB 2.0

Availability and Pricing

The BCM3556 digital TV SoC solution is now sampling to early access customers. Pricing is available upon request.

Texas Instruments Incorporated (TI) (NYSE:TXN) today announced its lowest-cost digital media processor, the TMS320DM335 device, for applications driven by advanced image capture and display requirements. Consumers will now be able to have enhanced interaction with their electronic devices such as Internet radio, e-books, video surveillance products and digital telescopes through feature-rich graphical user interfaces (GUIs). Powered by an ARM926EJ-S(TM) core up to 270 MHz, the DM335 digital media processor integrates a video processing subsystem (VPSS) so developers can easily add high-definition video display at 720p on their new class of portable applications.

Helping developers reduce overall system design overhead, the DM335 processor provides the benefits of greater than 25 percent cost reduction than its highly successful predecessor, the TMS320DM355 processor. The new digital media processor is completely scalable with the DM355 processor and Digital Video Evaluation Board (DVEVM), allowing customers to re-use both hardware and software designs for their new DM335 processor focused projects. The DM335 processor also offers a compelling solution for customers creating advanced user interface display applications that do not require video compression and decompression for a fraction of the cost.

The new DM335 device delivers a sophisticated suite of capabilities allowing for flexible image capture and display. Through its user interface technology, such as a four-level on-screen display, developers are able to create picture-within-picture and video-within-video as well as innovative GUIs. This is especially important for portable products that require the use of button or touch screen, such as portable karaoke, universal remote controls, video doorbells and electronic gaming applications.

For crisp and vibrant display images, the DM335 processor support CCD/CMOS image sensors, resize capability and video analytics. The 1280-by-960-pixel digital LCD connection runs on a 75-MHz pixel clock and supports TV composite output for increased expandability.

Rapid development with complete scalability

The DM335 processor provides a simple migration path for the many TI customers who are currently using the DM355 device and would like to expand their product line to include applications that do not require video encode and decode. This lower cost alternative offers full code and hardware compatibility without requiring additional investment in software engineering. The DM335 utilizes the same suite of peripherals as the DM355, such as high speed USB 2.0 on-the-go, external memory interface (EMIF), mobile DDR/DDR2, two SDIO ports, three UART Ports, three SPI Ports and SLC/MCL NAND Flash memory support. In addition, customers can leverage TI’s HPA portable audio solutions including low-power codecs like the TLV320AIC3104 and amplifiers, such as the TPA2016D2.

In addition to being pin-to-pin compatible with the DM355, the new DM335 device is also software compatible with all of TI’s digital media processor devices. This allows developers to have easy access to the application programming interfaces (APIs) common across TI’s digital media processor portfolio, enabling developers familiar with ARM(R) to rapidly start development with virtually no learning curve and concentrate on further differentiating their products. Developers can re-use intellectual property or utilize IP from the open-source resources for ARM-based processing to speed them throughout the development process.

For developers already creating applications based on the DM355 device, they can jump start their DM335 processor-based design by utilizing the same development kit and even use the same code for applications that do not require MPEG-4 or JPEG codec. The DM355 Digital DVEVM integrates an optimized MontaVista(R) Linux(R) board support package (BSP), drivers and display capture support for the VPSS to help developers easily build low-cost portable products. The DVEVM also support Windows(R) Embedded CE 6.0.

For an additional boost in support, developers can also rely on the industry’s largest Developer Network for algorithms and additional tools to produce sleeker applications cheaper and faster.

The TMS320DM335 digital media processor is now available for $10.48 in 100 units from TI. The highly integrated device is packaged in a 13 x 13 mm, 329 pin, 0.65 mm pitch BGA package. The TMDSEVM355 Digital Video Evaluation Module is now available for $495.

See also:

• Lam Research Corporation Releases 2300 Versys Kiyo3x Conductor Etch Series (0)
• GSS8000 High Dynamics GPS Simulation System (0)
• Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (0)
• Bluetooth SIG Opens New Doors to Small Businesses (0)
• CPU Tech Launches Acalis CPU872 MultiCore PowerPC with Embedded DRAM and Tamper Protection (0)

Intel’s new hafnium-based 45nm Hi-k silicon process technology enables even more processor performance by doubling transistor density and increasing cache size by up to 50 percent. The Intel Core2 Duo processor T9400, validated with the Mobile Intel GM45 Express chipset, provides excellent processor and graphics performance, storage speed, system memory and reliability, making it ideal for a broad range of embedded applications.

Over the past year, Intel has utilized Phoenix’s BIOS software on its reference boards. Phoenix’s firmware solutions provide complete support for current industry standards and initiatives.

Phoenix SecureCore and AwardCore for embedded applications are available now for the Intel Core2 Duo Processor T9400 with both the Mobile Intel GM45 Express chipset and the Intel 5100 Memory Controller Hub (MCH) chipset.

See also:

• Intel Fourth-Quarter Net Income $2.3 Billion, Up 875% (0)
• Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (0)
• New Intel Software Connects Health Networks, Enabling Key Data Sharing in Clinical Settings (0)

“As the industry transitions to double patterning as a key enabler of advanced device scaling, etch plays an increasingly important role in pattern shrinking. With the Kiyo3x series, we have extended our market-leading conductor etch product family to provide better uniformity, productivity, and repeatability to enable a range of the most complex as well as emerging critical etch applications on our customers’ technology roadmaps,” said Richard A. Gottscho, Lam Research group vice president and general manager, Etch Businesses. “By providing these capabilities as a configurable set of upgrade options, we allow our customers to maximize the value of their capital investments.”

As the third generation of the Kiyo™ product line, the new Kiyo3x series includes improvements in wafer temperature control that enable radial tuning for edge control and profile shaping. These improvements, coupled with enhanced reactor symmetry, result in CD uniformities of 1 nm, 3-sigma variation. With advanced, proprietary pre-coat and post-etch chamber clean techniques, every wafer sees the same environment for superior repeatability, as well as high uptime and yield. For complex film stacks such as high-k/metal gate, the Kiyo3x provides multi-film etch capability in a single chamber, which results in a 50-to-100 percent productivity advantage over a two-chamber approach.

Multiple Kiyo3x systems have been installed at major customer sites in regions worldwide to address a variety of emerging applications.

Contacts
Lam Research Corporation
Jae Jun, 510-572-5048
Product Communications
jae_yon.jun@lamresearch.com

or

MindWrite Communications
Sandy Fewkes, 408-224-4024
sandy@mind-write.com

See also:

• Design costs for portable display electronics drop with TI’s lowest cost digital media processor (0)
• GSS8000 High Dynamics GPS Simulation System (0)
• Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (0)
• Bluetooth SIG Opens New Doors to Small Businesses (0)
• CPU Tech Launches Acalis CPU872 MultiCore PowerPC with Embedded DRAM and Tamper Protection (0)

Andres Norling, CEO of Anoto says:

“OKI Printing Solution is the first printer manufacturer to achieve Anoto print qualification in January 2006 and we are pleased with the extended qualified product range since then. Printing forms on-demand in smaller quantities saves time, saves money and is the only way to efficiently print pre-populated forms. This is expected to grow so we look forward to strengthen the partnership to meet the growing on-demand printing need”

Harushige Sugimoto, President and CEO of OKI Printing Solutions says:

“Our unique High Definition Color LED technology meets the exacting requirements and offers a critical advantage for digital pen applications by providing an extremely accurate distribution of dot patterns. We will continue to offer Anoto qualified printers to provide Anoto’s end customers with absolute accuracy and best in class print quality.

C8800 key features summary:

* Models available: C8800n (networked), C8800dn (duplex and networked), C8800dtn (networked, duplex and additional paper tray. Available in Americas and Japan only), C8800cdtn (duplex, networked, with second tray and cabinet. Available in Europe only)
* Fast – Up to 26ppm for color printing, 32ppm for mono, with a fast time to first print at less than 10 seconds for color and mono. Print speed may vary based on application.
* Media flexibility – Prints on A6 – A3 and up to 200gsm; paper capacity up to 930 sheets
* Compact – 485 X 648 X 341 mm (W X D X H). About half the size of traditional tabloid printers.
* High Definition Color printing – Provides clear, crisp, and finer detail output.
* Ease-of-use – Equipped with standard “Additional Emulation”, necessary for printing forms based on Anoto technology.

OKI Printing Solutions’ Anoto qualified product range, the C8800, the C9800, the C5950 (Asia & Europe)/C6150 (Americas) and C9650 are available through OKI Printing Solutions’ regional sales offices and authorized resellers in the Americas, Europe and Asia Oceania.

The Spirent GSS8000 is designed for use in the most demanding applications, and is capable of simulating ultra-high dynamics with industry leading accuracy.

The Spirent GSS8000 supports up to 20,000g signal dynamics, up to 120,000 m/s velocity and 50Hz (4ms) processing rates. Motion data can be generated using Spirent’s on-board vehicle models or using real-time high-rate host vehicle trajectory data over a remote interface. Spirent’s implementation supports full 6 degrees-of-freedom (6DOF) trajectory data. Low-latency hardware-in-the-loop capability is standard with synchronization and timing facilitated via 1 PPS in/out and 10MHz clock inputs.

In addition, the Spirent GSS8000 is designed to support Spirent’s range of options and extensions for testing advanced navigation and positioning systems. These include a range of GPS+inertial test interfaces, classified testing capabilities, interference effects, jamming signals and multi-element adaptive antenna (CRPA) antenna electronics units.

“The Spirent GSS8000 offers our customers the test capability they demand, for both today and tomorrow’s programs,” commented John Pottle, marketing director, Positioning Technology division, Spirent Communications. “We are taking the simulator performance to the next level with the Spirent GSS8000, while maintaining Spirent’s full range of options and classified testing capabilities that our customers have come to rely on, such as classified testing and full test support for future M-code receiver programs.”

Spirent’s products are sold in the US and Canada by Spirent Federal Systems, a wholly owned subsidiary of Spirent Communications. You can learn more about the GSS8000 at their booth at IEEE/ION PLANS 2008 May 5-8, 2008 in Monterey, CA.

See also:

• Design costs for portable display electronics drop with TI’s lowest cost digital media processor (0)
• Lam Research Corporation Releases 2300 Versys Kiyo3x Conductor Etch Series (0)
• Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (0)
• Bluetooth SIG Opens New Doors to Small Businesses (0)
• Storage Appliance Corporation Introduces Clickfree Office DVD Backup (0)